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NAND FLASH


Package Design & Manufacturing 





NAND FLASH

Package Design & Manufacturing 

3D TLC NAND for NVMe SSD

   

   TLC 3D NAND makes up a significant portion of the total cost of SSDs and is critical for competitive performance and reliability. NAND used in FASTRO SSD is Tier 1 Grade, and our own solutions are applied to all processes from NAND packaging design to production. All manufactured products go through 100% RDT testing to check the BAD Block status of memory cells and classify defective products before shipping.


Key Specifications

Thorough quality control through in-house design and production

  

   Thorough quality control is possible because all SSD production processes such as circuit, PCB design, and memory tests are carried out as an in-house solution through a one-stop process. We minimize the defective rate through 100% RDT(Reliability Demonstration Test) testing for memory bad blocks and thorough quality testing.

3D TLC NAND for NVMe SSD



TLC 3D NAND makes up a significant portion of the total cost of SSDs and is critical for competitive performance and reliability. NAND used in FASTRO SSD is Tier 1 Grade, and our own solutions are applied to all processes from NAND packaging design to production. All manufactured products go through 100% RDT testing to check the BAD Block status of memory cells and classify defective products before shipping.

Key Specifications

Item
Specifications
Interface
Open NAND FLASH interface 4.0 Compliant
Form Factor
Dimension
12 x 18 x 1.3(mm)
Tnickness(max)
1.3(mm)
Die Grade
Good Die(Tier 1) 
Package Type
132 Ball, FBGA
NAND TypeCell Type
3D TLC
Stacking Process
V5｜V6｜V7
Capacity &
Package Stack		SDP(1Stack)
64GB｜128GB 
DDP(2Stack)128GB｜256GB
QDP(4Stack)
256GB｜512GB
ODP(8Stack)
512GB｜1TB
ReliabilityOperation TemperatureStandard Grade, 0°C ~ 70°C
Storage Temperature

Non-Operating, -40°C ~ +85°C

Block Erase Operation
17.25MB
Operating
Vcc
2.5V｜3.3V
Voltage
Vccq
1.2V｜1.8V
Data Transfer Rate
Up to 1,200Mbps

Thorough quality control through in-house design and production

Thorough quality control is possible because all SSD production processes such as circuit, PCB design, and memory tests are carried out as an in-house solution through a one-stop process. We minimize the defective rate through 100% RDT(Reliability Demonstration Test) testing for memory bad blocks and thorough quality testing.