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SSD in BGA Package


Solder down BGA package for rugged embedded systems





BGA SSD

SSD in BGA Package

BGA SSD Integration

   

   BGA SSD is a technology that integrates NAND Flash, DRAM, and Controller chip into one package. Mdevice developed the BGA SSD using SiP technology, which allows for improved performance and miniaturization, to provide higher sustained performance during high workloads and extremely hot operation.

Key Specifications

Thorough quality control through in-house design and production

  

   Thorough quality control is possible because all SSD production processes such as circuit, PCB design, and memory tests are carried out as an in-house solution through a one-stop process. We minimize the defective rate through 100% RDT(Reliability Demonstration Test) testing for memory bad blocks and thorough quality testing.

BGA SSD Integration



   BGA SSD is a technology that integrates NAND Flash, DRAM, and Controller chip into one package. Mdevice developed the BGA SSD using SiP technology, which allows for improved performance and miniaturization, to provide higher sustained performance during high workloads and extremely hot operation.


Key Specifications

Thorough quality control through in-house design and production

Thorough quality control is possible because all SSD production processes such as circuit, PCB design, and memory tests are carried out as an in-house solution through a one-stop process. We minimize the defective rate through 100% RDT(Reliability Demonstration Test) testing for memory bad blocks and thorough quality testing.